Die Bonder Equipment Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Size, Share & Trends, Drivers, Restraints, Opportunities, Manufacturer, Applications, And Segments

  • AMR-1066249
  • May 2021
  • Semiconductor and Electronics
  • 138 Pages
The Die Bonder Equipment market research report provides an in-depth analysis of the currents trends, latest developments, scenario, market size, various drivers, restraints, and major players along with their profile details. Research report offers the historic data for year 2018 and 2019 and also provides the forecast data from year 2020 to 2028 which is based on revenue (USD Million). With the help of all these information research report helps the market participants to improve market positions. With the help of all these insights Die Bonder Equipment market research report recommends a business strategy for present market participants to strengthen their position in the market.
 
Report Parameters Details of Parameter
Market Size xx Million
Based Year 2020
Forecast Period Covered 2020 – 2028
Units for value Revenue in USD million and CAGR from 2020 to 2028
Covered Segments Component, Types, Applications, End-Users, and more.
Companies Covered ASM Pacific Technology Limited, BE Semiconductor Industries N.V. (Besi), Dr. Tresky AG, Finetech GmbH and Co KG., Kulicke and Soffa Industries, Inc., MicroAssembly Technologies, Ltd. (MAT), Mycronic AB, Palomar Technologies Inc., SET Corporation SA, West·Bond, Inc.
Region Covered North America, Europe, Asia Pacific, Latin America, Middle East and Africa

COVID-19 Impact Analysis
The analysis of covid-19 is based on the impact of the current pandemic situation on market scenarios. This includes impact of covid-19 outbreak on overall revenue, market segments as well as regional market. The report also puts light on detailed impact analysis by taking into consideration all the government policies imposed during the pandemic situation, temporary shutdown of manufacturing units, current state of supply chain and distributors, and its future impacts on the growth of overall market. The market study will assist user to understand the global demand and impose strategic business plans to compete with the peers.

Furthermore, the research report includes the detailed information about major players and provides the data regarding the current market scenario as well as upcoming market opportunities or challenges. Similarly, in segment report covers the types, and applications according to the countries and key regions. The research report consists the various drivers and restraints for Die Bonder Equipment market along with their effects over the forecast period. Similarly, according to the region Die Bonder Equipment market research report includes the study of opportunities available in the market situation.

The Die Bonder Equipment market research report provides the in-depth data analysis by using the various graphs, figures, charts, and tables. Furthermore, the report provides the different business challenges which are impacting market growth in all direction.

Major Key Players for Global Die Bonder Equipment Market:
The Die Bonder Equipment market research report offers the company profile of major key players including progress trends, competitive landscape breakdown, and key in regions development status. ASM Pacific Technology Limited, BE Semiconductor Industries N.V. (Besi), Dr. Tresky AG, Finetech GmbH and Co KG., Kulicke and Soffa Industries, Inc., MicroAssembly Technologies, Ltd. (MAT), Mycronic AB, Palomar Technologies Inc., SET Corporation SA, West·Bond, Inc.

Die Bonder Equipment Market Segmentation Analysis:
by Type
Fully Automatic Die Bonders
Manual Die Bonders
Semiautomatic Die Bonders
Bonding Technique
Soft Solder
Eutectic
Epoxy
Others
Device
MEMS and MOEMS
Optoelectronics
Power Devices
Application
Consumer Electronics
Healthcare
Aerospace and Defense
Automotive
Telecommunications
Industrial
Others

Global Die Bonder Equipment Market Segmentation by Regions:
In regional analysis, Die Bonder Equipment market research report provides the detailed analysis from various regions and also contains the detailed analysis of country. Along with market revenue, market value report also offers the forecast analysis for the following countries and regions. Global Die Bonder Equipment market report covers the various geographical regions such as North America, Asia-Pacific, Europe, Latin America, and Middle East & Africa. Also, various countries included are Canada, U.K., France, the U.S., Japan, China, India, and Germany and so on.

North America Region for Die Bonder Equipment Market: Value and Forecast
  • U.S.
  • Canada
 Europe Region for Die Bonder Equipment Market: Value and Forecast
  • UK
  • Germany
  • France
  • Rest of the Europe
 Asia Pacific Region for Die Bonder Equipment Market: Value and Forecast
  • China
  • Japan
  • India
  • Rest of the Asia Pacific
 Latin America Region for Die Bonder Equipment Market: Value and Forecast
  • Mexico
  • Brazil
  • Rest of the Latin America
 Middle East and Africa for Die Bonder Equipment Market: Value and Forecast
  • GCC Countries
  • South Africa
  • Rest of Middle East and Africa


Important Points Covered by Report:
  • To analyze the value of the Die Bonder Equipment market, according to the key region.
  • To study the Die Bonder Equipment market current trends, prospects and also their participation in the entire sector.
  • Report consists the in-depth information related to the region/countries, major key players, current trends and their analysis, product type, applications, and other background information
  • Report provides the detailed information about drivers, restraints and future scope of Die Bonder Equipment market.
  • Report covers the information about historic data analysis as well as forecast period analysis.

Global Die Bonder Equipment research report consist the information about overall sales and revenue during the historic and forecasted period of 2018 to 2028. Additionally, this report covers the inside and out factual examination and the market elements and requests which give an entire situation of the business.

Key Analytical Areas:
The report aims to offer a complete solution to various businesses operating in the Die Bonder Equipment market in making strategic decisions based on credible information and actionable insights. Thereby, the report covers various aspects of your requirements such as industry overview, market dynamics, regional analysis and competitive landscape. The report aims to provide insights to businesses in the Die Bonder Equipment market for numerous purposes such as:

    1. Strategic Decision Making:
With the help of this report, key decision makers can quickly analyze and identify growth opportunities in terms of numerous segments across various geographical regions. Thereby, this report enables organizations to identify and make strategic investments in specific market segments in order to gain maximum return on investment.

     2. Actionable Insights:
The report offers a deep dive into how companies are leveraging market conditions to make the most in the Die Bonder Equipment market. Thereby, the report offers numerous actionable insights into the best practices and key success factors relevant in the Die Bonder Equipment market. Using the insights included in the report, businesses can make quick decisions to achieve success in business operations.

     3. Competitive Snapshot:
In addition, to detailed information on the companies operating in the Die Bonder Equipment market, the report also includes a competitive snapshot of all the companies covered in the report. Thereby, this offers a visual representation of how all the companies stand comparatively based on their competencies, geographic presence, market hold, years of operations, employee and financial strength, among others.

Manufacturers and Segments

  • ASM Pacific Technology Limited
  • BE Semiconductor Industries N.V. (Besi)
  • Dr. Tresky AG
  • Finetech GmbH and Co KG.
  • Kulicke and Soffa Industries, Inc.
  • MicroAssembly Technologies, Ltd. (MAT)
  • Mycronic AB
  • Palomar Technologies Inc.
  • SET Corporation SA
  • West·Bond, Inc.
  • Fully Automatic Die Bonders
  • Manual Die Bonders
  • Semiautomatic Die Bonders
  • Consumer Electronics
  • Healthcare
  • Aerospace and Defense
  • Automotive
  • Telecommunications
  • Industrial
  • Others

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1. Preface
     1.1. Report Scope and Description
     1.2. Research Methodology
          1.2.1. Phase I-Secondary Research
          1.2.2. Phase II-Primary Research
          1.2.3. Phase II-Expert Panel Review
          1.2.4. Assumptions
          1.2.5. Approach Adopted

2. Executive Summarysegment Form
     2.1. Global Die Bonder Equipment Market Snapshot
          2.1.1. Global Die Bonder Equipment Market By Type,2019
               2.1.1.1.Fully Automatic Die Bonders
               2.1.1.2.Manual Die Bonders
               2.1.1.3.Semiautomatic Die Bonders
          2.1.2. Global Die Bonder Equipment Market By Application,2019
               2.1.2.1.Consumer Electronics
               2.1.2.2.Healthcare
               2.1.2.3.Aerospace and Defense
               2.1.2.4.Automotive
               2.1.2.5.Telecommunications
               2.1.2.6.Industrial
               2.1.2.7.Others
          2.1.3. Global Die Bonder Equipment Market By End-use,2019
          2.1.4. Global Die Bonder Equipment Market By Geography,2019

3. Global Die Bonder Equipment Market Dynamics
     3.1. Market Overview
     3.2. Market Inclination Insights Analysis
     3.3. Drivers
     3.4. Challenges
     3.5. Future Prospects
     3.6. Impact Analysis of Drivers and Challenges During the Forecast Period, (2020-2028)

4. Global Die Bonder Equipment Market Size (US$), By Type, 2018 – 2028 
     4.1. Overview
          4.1.1. Market Share Analysis By Type, 2019 vs.2028
          4.1.2. Attractive Investment Proposition By Type, 2020
     4.2. Global Die Bonder Equipment Market Size (US$), By Type, 2018 – 2028

5. Global Die Bonder Equipment Market Size (US$), By Application, 2018 – 2028 
     5.1. Overview
          5.1.1. Market Share Analysis By Application, 2019 vs.2028
          5.1.2. Attractive Investment Proposition By Application, 2020
     5.2. Global Die Bonder Equipment Market Size (US$), By Application, 2018 – 2028

6. Global Die Bonder Equipment Market Size (US$), By End-use, 2018 – 2028 
     6.1. Overview
          6.1.1. Market Share Analysis By End-use, 2019 vs.2028
          6.1.2. Attractive Investment Proposition By End-use, 2020
     6.2. Global Die Bonder Equipment Market Size (US$), By End-use, 2018 – 2028

7. Global Die Bonder Equipment Market Size (US$), By Geography, 2018 – 2028
     7.1. Overview
          7.1.1. Market Share Analysis by Geography, 2019 vs. 2028
          7.1.2. Attractive Investment Proposition by Geography, 2020
     7.2. North America Die Bonder Equipment Market Analysis, 2018 – 2028 
          7.2.1. North America Die Bonder Equipment Market Size (US$), By Country, 2018 – 2028 
               7.2.1.1. U.S.
               7.2.1.2. Canada
          7.2.2. North America Die Bonder Equipment Market Size (US$), By Type, 2018 – 2028
          7.2.3. North America Die Bonder Equipment Market Size (US$), By Application, 2018 – 2028
          7.2.4. North America Die Bonder Equipment Market Size (US$), By End-use, 2018 – 2028
     7.3. Europe Die Bonder Equipment Market Analysis, 2018 – 2028 
          7.3.1.  Europe Die Bonder Equipment Market Size (US$), By Country, 2018 – 2028 
               7.3.1.1. U.K.
               7.3.1.2. Germany
               7.3.1.3. France
               7.3.1.4. Rest of Europe
          7.3.2. Europe Die Bonder Equipment Market Size (US$), By Type, 2018 – 2028
          7.3.3. Europe Die Bonder Equipment Market Size (US$), By Application, 2018 – 2028
          7.3.4. Europe Die Bonder Equipment Market Size (US$), By End-use, 2018 – 2028
     7.4. Asia Pacific Die Bonder Equipment Market Analysis , 2018 – 2028
          7.4.1.  Asia Pacific Die Bonder Equipment Market Size (US$), By Country, 2018 – 2028 
               7.4.1.1. China
               7.4.1.2. Japan
               7.4.1.3. India
               7.4.1.4. Rest of Asia Pacific
          7.4.2. Asia Pacific Die Bonder Equipment Market Size (US$), By Type, 2018 – 2028
          7.4.3. Asia Pacific Die Bonder Equipment Market Size (US$), By Application, 2018 – 2028
          7.4.4. Asia Pacific Die Bonder Equipment Market Size (US$), By End-use, 2018 – 2028
     7.5. Latin America Die Bonder Equipment Market Analysis, 2018 – 2028 
          7.5.1.  Latin America Die Bonder Equipment Market Size (US$), By Country, 2018 – 2028 
               7.5.1.1. Brazil
               7.5.1.2. Mexico
               7.5.1.3. Rest of Latin America
          7.5.2. Latin America Die Bonder Equipment Market Size (US$), By Type, 2018 – 2028
          7.5.3. Latin America Die Bonder Equipment Market Size (US$), By Application, 2018 – 2028
          7.5.4. Latin America Die Bonder Equipment Market Size (US$), By End-use, 2018 – 2028
     7.6. Middle East & Africa (MEA) Die Bonder Equipment Market Analysis, 2018 – 2028 
          7.6.1.  MEA Die Bonder Equipment Market Size (US$), By Region, 2018 – 2028 
               7.6.1.1. GCC Countries
               7.6.1.2. South Africa
               7.6.1.3. Rest of MEA
          7.6.2. MEA Die Bonder Equipment Market Size (US$), By Type, 2018 – 2028
          7.6.3. MEA Die Bonder Equipment Market Size (US$), By Application, 2018 – 2028
          7.6.4. MEA Die Bonder Equipment Market Size (US$), By End-use, 2018 – 2028

8. Company Profiles
     8.1. Competitive Analysis 
     8.2. Market Positioning of Key Vendors 
     8.3. Key Strategies adopted by the Leading Players
     8.4. Key Die Bonder Equipment Providers
        8.4.1 ASM Pacific Technology Limited
                8.4.1.1 Business Description
                8.4.1.2 ASM Pacific Technology Limited Geographic Operations
                8.4.1.3 ASM Pacific Technology Limited Financial Information
                8.4.1.4 ASM Pacific Technology Limited Product Positions/Portfolio
                8.4.1.5 ASM Pacific Technology Limited Key Developments
        8.4.2 BE Semiconductor Industries N.V. (Besi)
                8.4.2.1 Business Description
                8.4.2.2 BE Semiconductor Industries N.V. (Besi) Geographic Operations
                8.4.2.3 BE Semiconductor Industries N.V. (Besi) Financial Information
                8.4.2.4 BE Semiconductor Industries N.V. (Besi) Product Positions/Portfolio
                8.4.2.5 BE Semiconductor Industries N.V. (Besi) Key Developments
        8.4.3 Dr. Tresky AG
                8.4.3.1 Business Description
                8.4.3.2 Dr. Tresky AG Geographic Operations
                8.4.3.3 Dr. Tresky AG Financial Information
                8.4.3.4 Dr. Tresky AG Product Positions/Portfolio
                8.4.3.5 Dr. Tresky AG Key Developments
        8.4.4 Finetech GmbH and Co KG.
                8.4.4.1 Business Description
                8.4.4.2 Finetech GmbH and Co KG. Geographic Operations
                8.4.4.3 Finetech GmbH and Co KG. Financial Information
                8.4.4.4 Finetech GmbH and Co KG. Product Positions/Portfolio
                8.4.4.5 Finetech GmbH and Co KG. Key Developments
        8.4.5 Kulicke and Soffa Industries, Inc.
                8.4.5.1 Business Description
                8.4.5.2 Kulicke and Soffa Industries, Inc. Geographic Operations
                8.4.5.3 Kulicke and Soffa Industries, Inc. Financial Information
                8.4.5.4 Kulicke and Soffa Industries, Inc. Product Positions/Portfolio
                8.4.5.5 Kulicke and Soffa Industries, Inc. Key Developments
        8.4.6 MicroAssembly Technologies, Ltd. (MAT)
                8.4.6.1 Business Description
                8.4.6.2 MicroAssembly Technologies, Ltd. (MAT) Geographic Operations
                8.4.6.3 MicroAssembly Technologies, Ltd. (MAT) Financial Information
                8.4.6.4 MicroAssembly Technologies, Ltd. (MAT) Product Positions/Portfolio
                8.4.6.5 MicroAssembly Technologies, Ltd. (MAT) Key Developments
        8.4.7 Mycronic AB
                8.4.7.1 Business Description
                8.4.7.2 Mycronic AB Geographic Operations
                8.4.7.3 Mycronic AB Financial Information
                8.4.7.4 Mycronic AB Product Positions/Portfolio
                8.4.7.5 Mycronic AB Key Developments
        8.4.8 Palomar Technologies Inc.
                8.4.8.1 Business Description
                8.4.8.2 Palomar Technologies Inc. Geographic Operations
                8.4.8.3 Palomar Technologies Inc. Financial Information
                8.4.8.4 Palomar Technologies Inc. Product Positions/Portfolio
                8.4.8.5 Palomar Technologies Inc. Key Developments
        8.4.9 SET Corporation SA
                8.4.9.1 Business Description
                8.4.9.2 SET Corporation SA Geographic Operations
                8.4.9.3 SET Corporation SA Financial Information
                8.4.9.4 SET Corporation SA Product Positions/Portfolio
                8.4.9.5 SET Corporation SA Key Developments
        8.4.10 West·Bond, Inc.
                8.4.10.1 Business Description
                8.4.10.2 West·Bond, Inc. Geographic Operations
                8.4.10.3 West·Bond, Inc. Financial Information
                8.4.10.4 West·Bond, Inc. Product Positions/Portfolio
                8.4.10.5 West·Bond, Inc. Key Developments

LIST OF TABLES

TABLE 1 Market Snapshot: Global Die Bonder Equipment Market 
TABLE 2 Impact Indicators 
TABLE 3 Impact Analysis of Drivers and Restraints 
TABLE 4 North America Die Bonder Equipment Market Revenue, By Type, 2018 – 2028 (US$ Mn) 
TABLE 5 North America Die Bonder Equipment Market Revenue, By Application, 2018 – 2028 (US$ Mn) 
TABLE 6 North America Die Bonder Equipment Market Revenue, By End-use, 2018 – 2028 (US$ Mn) 
TABLE 7 Europe Die Bonder Equipment Market Revenue, By Type, 2018 – 2028 (US$ Mn) 
TABLE 8 Europe Die Bonder Equipment Market Revenue, By Application, 2018 – 2028 (US$ Mn) 
TABLE 9 Europe Die Bonder Equipment Market Revenue, By End-use, 2018 – 2028 (US$ Mn) 
TABLE 10 Asia Pacific Die Bonder Equipment Market Revenue, By Type, 2018 – 2028 (US$ Mn) 
TABLE 11 Asia Pacific Die Bonder Equipment Market Revenue, By Application, 2018 – 2028 (US$ Mn) 
TABLE 12 Asia Pacific Die Bonder Equipment Market Revenue, By End-use, 2018 – 2028 (US$ Mn) 
TABLE 13 Latin America Die Bonder Equipment Market Revenue, By Type, 2018 – 2028 (US$ Mn) 
TABLE 14 Latin America Die Bonder Equipment Market Revenue, By Application, 2018 – 2028 (US$ Mn) 
TABLE 15 Latin America Die Bonder Equipment Market Revenue, By End-use, 2018 – 2028 (US$ Mn)
TABLE 16 MEA Die Bonder Equipment Market Revenue, By Type, 2018 – 2028 (US$ Mn) 
TABLE 17 MEA Die Bonder Equipment Market Revenue, By Application, 2018 – 2028 (US$ Mn) 
TABLE 18 MEA Die Bonder Equipment Market Revenue, By End-use, 2018 – 2028 (US$ Mn)

LIST OF FIGURES

FIG. 1 Global Die Bonder Equipment: Market Segmentation 
FIG. 2 Global Die Bonder Equipment Market: Research Methodology 
FIG. 3 Top-Down and Bottom-up Approach 
FIG. 4 Global Die Bonder Equipment Market, By Type, 2019 (US$ Mn) 
FIG. 5 Global Die Bonder Equipment Market, By Application, 2019 (US$ Mn) 
FIG. 6 Global Die Bonder Equipment Market, By End-use, 2019 (US$ Mn) 
FIG. 7 Global Die Bonder Equipment Market, By Geography, 2019 (US$ Mn) 
FIG. 8 Global Die Bonder Equipment Market Revenue and Growth, 2018 – 2028, (US$ Mn) (Y-o-Y %)
FIG. 9 Attractive Investment Proposition 
FIG. 10 Market Positioning of Key Die Bonder Equipment Providers, 2019
FIG. 11 Global Die Bonder Equipment Market Revenue Contribution, By Type, 2019 & 2028 (Value %) 
FIG. 12 Global Die Bonder Equipment Market Revenue Contribution, By Application, 2019 & 2028 (Value %) 
FIG. 13 Global Die Bonder Equipment Market Revenue Contribution, By End-use, 2019 & 2028 (Value %) 
FIG. 14 North America Die Bonder Equipment Market Revenue, 2018 – 2028, (US$ Mn) 
FIG. 15 Europe Die Bonder Equipment Market Revenue, 2018 – 2028, (US$ Mn) 
FIG. 16 Asia Pacific Die Bonder Equipment Market Revenue, 2018 – 2028, (US$ Mn) 
FIG. 17 Latin America Die Bonder Equipment Market Revenue, 2018 – 2028, (US$ Mn)
FIG. 18 MEA Die Bonder Equipment Market Revenue, 2018 – 2028, (US$ Mn)

Key Takeaways:

1. Market value and estimate of the Die Bonder Equipment market for the period from 2020 to 2028
2. Compounded annual growth rate (CAGR%) for individual segments in various regional markets for a period from 2020 to 2028
3. Value chain analysis
4. Market share study combined with competitive landscape of major players
5. Profiles of major market players covering overall business operations, geographic occurrence, product portfolio, financial status and news coverage 

List of Tables

TABLE  Market Snapshot: Global Die Bonder Equipment Market
TABLE  Impact Pointers
TABLE  Impact Analysis of Drivers and Restraints
TABLE  North America Die Bonder Equipment Market Value, By Segment1, 2018 – 2028
TABLE  North America Die Bonder Equipment Market Value, By Segment2, 2018 – 2028
TABLE  North America Die Bonder Equipment Market Value, By Country, 2018 – 2028
TABLE  Europe Die Bonder Equipment Market Value, By Segment1, 2018 – 2028
TABLE  Europe Die Bonder Equipment Market Value, By Segment2, 2018 – 2028
TABLE  Europe Die Bonder Equipment Market Value, By Country, 2018 – 2028
TABLE  Asia Pacific Die Bonder Equipment Market Value, By Segment1, 2018 – 2028
TABLE  Asia Pacific Die Bonder Equipment Market Value, By Segment2, 2018 – 2028
TABLE  Asia Pacific Die Bonder Equipment Market Value, By Country, 2018 – 2028
TABLE  Latin America Die Bonder Equipment Market Value, By Segment1, 2018 – 2028
TABLE  Latin America Die Bonder Equipment Market Value, By Segment2, 2018 – 2028
TABLE  Latin America Die Bonder Equipment Market Value, By Country, 2018 – 2028
TABLE  MEA Die Bonder Equipment Market Value, By Segment1, 2018 – 2028
TABLE  MEA Die Bonder Equipment Market Value, By Segment2, 2018 – 2028
TABLE  MEA Die Bonder Equipment Market Value, By Country, 2018 – 2028
TABLE  ASM Pacific Technology Limited: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  BE Semiconductor Industries N.V. (Besi): Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Dr. Tresky AG: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Finetech GmbH and Co KG.: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Kulicke and Soffa Industries, Inc.: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  MicroAssembly Technologies, Ltd. (MAT): Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Mycronic AB: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Palomar Technologies Inc.: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  SET Corporation SA: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  West·Bond, Inc.: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
 

List of Figures

FIG.  Global Die Bonder Equipment Market: Research Methodology
FIG.  Top-Down and Bottom Up Approach
FIG.  Global Die Bonder Equipment Market, By Segment1, 2019 (US$ Mn)
FIG.  Global Die Bonder Equipment Market, By Segment2, 2019 (US$ Mn)
FIG.  Global Die Bonder Equipment Market, By Geography, 2019 (US$ Mn)
FIG.  Global Die Bonder Equipment Market Value and Growth, 2018 – 2028, (US$ Mn) (Y-o-Y %)
FIG.  Attractive Investment Proposition
FIG.  Market Positioning of Key Die Bonder Equipment Providers, 2016
FIG.  Global Die Bonder Equipment Market Value Share, By Segment1, 2019 & 2028 (% Value)
FIG.  Global Manual Die Bonders Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Semiautomatic Die Bonders Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Die Bonder Equipment Market Value Share, By Segment2, 2019 & 2028 (% Value)
FIG.  Global Healthcare Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Aerospace and Defense Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Automotive Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Telecommunications Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Industrial Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Others Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Market Value, 2018 – 2028, (US$ Mn)
FIG.  U.S. Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  Canada Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  UK Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  Germany Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  France Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  Rest of Europe Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  China Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  Japan Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  India Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  Rest of Asia Pacific Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  Mexico Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  Brazil Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  Rest of Latin America Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  GCC Countries Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  South Africa Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  Rest of MEA Die Bonder Equipment Market Value, 2018 – 2028, (US$ Mn)