Power Module Packaging Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Size, Share & Trends, Drivers, Restraints, Opportunities, Manufacturer, Applications, And Segments

  • AMR-1063764
  • May 2021
  • Semiconductor and Electronics
  • 111 Pages
The Power Module Packaging Market research report comprises of an overall in depth-analysis such as market drivers, opportunities, restraints, latest developments and trends, segmentation of the market, competitive analysis, global as well as regional analysis by showcasing how each of these factors can improve the further growth of the market on an overall perspective. The report also showcases the overall market value which includes the historic data (2018-2019) and forecast data (2020-2028) generated through the revenue (USD Mn)
 
Report Parameters Details of Parameter
Market Size xx Million
Based Year 2020
Forecast Period Covered 2020 – 2028
Units for value Revenue in USD million and CAGR from 2020 to 2028
Covered Segments Component, Types, Applications, End-Users, and more.
Companies Covered ACI Technologies, Inc., Danfoss, Fuji Electric Co., Ltd., Infineon Technologies AG, Maxim Integrated, Microsemi, Mitsubishi Electric Corporation, SEMIKRON, Texas Instruments Incorporated
Region Covered North America, Europe, Asia Pacific, Latin America, Middle East and Africa

COVID-19 Coverage
With the beginning of the COVID-19 pandemic in early 2020, all major economies around the world enforced severe lockdown restrictions to curb the spread of the virus. Apart from a few sectors such as healthcare and related essential services, most of the industries suffered tremendously due to inability to function in a normal fashion. Moreover, even some of the essential sectors suffered due to delays caused by supply chain disruptions and other travel complexities. However, with massive vaccination drives in most of the developed economies, some of the economies across the world experienced economic recovery from 2021. The Power Module Packaging market is expected to gain momentum in such economies and probably recover some of the losses inflicted in the year 2020. With continued efforts towards curbing the virus in the developing economies, the Power Module Packaging market is expected to attain Pre COVID-19 levels by mid-2022.

Power Module Packaging Report’s Assessment
The research report is formulated such that it offers a deep understating on the market drivers that are assimilating the growth of the market, the market opportunities that are going to provide future growth factors for the market and the market restraints which showcase the reasons as to why the market can get hampered and dissimilated. All these factors are considered keeping in view the historic and forecast analysis which can enlighten the above mentioned factors.

Thereby at a glance a reader can understand all the factors and prospects of the Power Module Packaging market and how it can assimilate and dissimilate based on each of the factors and figures mentioned in the report

Power Module Packaging Market Competitive and Premeditated Analysis
In the Power Module Packaging report major factors such latest tactical developments, competitors, research and development, participation of each region in the market and the competition among them, the latest news regarding company acquisitions and product launch, revenue of the competitors as well as the key offerings they provide all these factors are mentioned in the report with reasons to justify and understand them in depth.

The readers and purchaser of the Power Module Packaging research report can gain a comprehensive understanding of the market competition, the revenue of each major players and their contribution towards the market, attractive proposition analysis is provided in the report which sub divides the segments with respect to the largest segment that has contributed to the market growth and the fastest growing segment based on the size of the market as well as its overall appeal.
 
Major Key Players for Global Power Module Packaging Market:
The Power Module Packaging market research report offers the company profile of major key players including progress trends, competitive landscape breakdown, and key in regions development status. ACI Technologies, Inc., Danfoss, Fuji Electric Co., Ltd., Infineon Technologies AG, Maxim Integrated, Microsemi, Mitsubishi Electric Corporation, SEMIKRON, Texas Instruments Incorporated

The Power Module Packaging market report showcases vast potentials of growth and assimilation which is going to provide the industry numerous opportunities to grow and generate revenue by understanding the segments and which segment is a potential part to increase the disposable income in the present and upcoming years.

Power Module Packaging Market Segmentation Analysis:
Each of the segment is explained in brief along with the revenue it generates for the market based on the historic and forecast data by highlighting the largest segment and the fastest growing segment with reasons to justify it.

The Global segmentation of the Power Module Packaging market:
by Type
GaN Module
SiC Module
FET Module
IGBT Module
Thyristors
Industry Vertical
Information Technology
Consumer
Automatic
Industrial
Application
Electric Vehicles
EV/Hybrid Electric Vehicles
HEV
Motors
Rail Tractions
Wind Turbines
Photovoltaic Equipment

Regional Analysis of the Power Module Packaging market:
The Power Module Packaging market is dived based on different regions such as North America, Europe, Asia Pacific, Latin America and the Middle East and Africa. And the analysis of each region is provided by highlighting the largest contribution region, the fastest growing region and the factors that is keeping the market active in the other regions is also mentioned in depth. Each regional segment also comprises of the revenue each segment holds in a specific region with reasons to justify the values.

By Regions:
  • North America (U.S and Canada)
  • Europe (U.K., Germany and France)
  • Asia Pacific (China, India and Japan)
  • Latin America (Mexico and Brazil)
  • Middle East and Africa (GCC Countries and South Africa)
 


Major Factors Included and highlighted in the Power Module Packaging report are as follows:
  • The overall market value along with historic and future data analysis.
  • The Growth drivers, opportunities and restraints are mention in detail.
  • The size of the entire Power Module Packaging market on a global perspective.
  • The CAGR value of the overall market from 2020 to 2028.
  • COVID-19 impact on the Power Module Packaging market and how it is coping up with the situation.
  • Major competitors and their contribution towards the market.
  • The segmentation analysis is included which provides a clear picture of the market bifurcation.
  • Tables and graphs that can easily been understood at a glance
  • Latest trends and news related to the Power Module Packaging market is included in the report.
Key Analytical Areas:
The report aims to offer a complete solution to various businesses operating in the Power Module Packaging market in making strategic decisions based on credible information and actionable insights. Thereby, the report covers various aspects of your requirements such as industry overview, market dynamics, regional analysis and competitive landscape. The report aims to provide insights to businesses in the Power Module Packaging market for numerous purposes such as:

     1. Strategic Decision Making:
With the help of this report, key decision makers can quickly analyze and identify growth opportunities in terms of numerous segments across various geographical regions. Thereby, this report enables organizations to identify and make strategic investments in specific market segments in order to gain maximum return on investment.

     2. Actionable Insights:
The report offers a deep dive into how companies are leveraging market conditions to make the most in the Power Module Packaging market. Thereby, the report offers numerous actionable insights into the best practices and key success factors relevant in the Power Module Packaging market. Using the insights included in the report, businesses can make quick decisions to achieve success in business operations.

     3. Competitive Snapshot:
In addition, to detailed information on the companies operating in the Power Module Packaging market, the report also includes a competitive snapshot of all the companies covered in the report. Thereby, this offers a visual representation of how all the companies stand comparatively based on their competencies, geographic presence, market hold, years of operations, employee and financial strength, among others.

Manufacturers and Segments

  • ACI Technologies, Inc.
  • Danfoss
  • Fuji Electric Co., Ltd.
  • Infineon Technologies AG
  • Maxim Integrated
  • Microsemi
  • Mitsubishi Electric Corporation
  • SEMIKRON
  • Texas Instruments Incorporated
  • GaN Module
  • SiC Module
  • FET Module
  • IGBT Module
  • Thyristors
  • Electric Vehicles
  • EV/Hybrid Electric Vehicles
  • HEV
  • Motors
  • Rail Tractions
  • Wind Turbines
  • Photovoltaic Equipment

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1. Preface
     1.1. Report Scope and Description
     1.2. Research Methodology
          1.2.1. Phase I-Secondary Research
          1.2.2. Phase II-Primary Research
          1.2.3. Phase II-Expert Panel Review
          1.2.4. Assumptions
          1.2.5. Approach Adopted

2. Executive Summarysegment Form
     2.1. Global Power Module Packaging Market Snapshot
          2.1.1. Global Power Module Packaging Market By Type,2019
               2.1.1.1.GaN Module
               2.1.1.2.SiC Module
               2.1.1.3.FET Module
               2.1.1.4.IGBT Module
               2.1.1.5.Thyristors
          2.1.2. Global Power Module Packaging Market By Application,2019
               2.1.2.1.Electric Vehicles
               2.1.2.2.EV/Hybrid Electric Vehicles
               2.1.2.3.HEV
               2.1.2.4.Motors
               2.1.2.5.Rail Tractions
               2.1.2.6.Wind Turbines
               2.1.2.7.Photovoltaic Equipment
          2.1.3. Global Power Module Packaging Market By End-use,2019
          2.1.4. Global Power Module Packaging Market By Geography,2019

3. Global Power Module Packaging Market Dynamics
     3.1. Market Overview
     3.2. Market Inclination Insights Analysis
     3.3. Drivers
     3.4. Challenges
     3.5. Future Prospects
     3.6. Impact Analysis of Drivers and Challenges During the Forecast Period, (2020-2028)

4. Global Power Module Packaging Market Size (US$), By Type, 2018 – 2028 
     4.1. Overview
          4.1.1. Market Share Analysis By Type, 2019 vs.2028
          4.1.2. Attractive Investment Proposition By Type, 2020
     4.2. Global Power Module Packaging Market Size (US$), By Type, 2018 – 2028

5. Global Power Module Packaging Market Size (US$), By Application, 2018 – 2028 
     5.1. Overview
          5.1.1. Market Share Analysis By Application, 2019 vs.2028
          5.1.2. Attractive Investment Proposition By Application, 2020
     5.2. Global Power Module Packaging Market Size (US$), By Application, 2018 – 2028

6. Global Power Module Packaging Market Size (US$), By End-use, 2018 – 2028 
     6.1. Overview
          6.1.1. Market Share Analysis By End-use, 2019 vs.2028
          6.1.2. Attractive Investment Proposition By End-use, 2020
     6.2. Global Power Module Packaging Market Size (US$), By End-use, 2018 – 2028

7. Global Power Module Packaging Market Size (US$), By Geography, 2018 – 2028
     7.1. Overview
          7.1.1. Market Share Analysis by Geography, 2019 vs. 2028
          7.1.2. Attractive Investment Proposition by Geography, 2020
     7.2. North America Power Module Packaging Market Analysis, 2018 – 2028 
          7.2.1. North America Power Module Packaging Market Size (US$), By Country, 2018 – 2028 
               7.2.1.1. U.S.
               7.2.1.2. Canada
          7.2.2. North America Power Module Packaging Market Size (US$), By Type, 2018 – 2028
          7.2.3. North America Power Module Packaging Market Size (US$), By Application, 2018 – 2028
          7.2.4. North America Power Module Packaging Market Size (US$), By End-use, 2018 – 2028
     7.3. Europe Power Module Packaging Market Analysis, 2018 – 2028 
          7.3.1.  Europe Power Module Packaging Market Size (US$), By Country, 2018 – 2028 
               7.3.1.1. U.K.
               7.3.1.2. Germany
               7.3.1.3. France
               7.3.1.4. Rest of Europe
          7.3.2. Europe Power Module Packaging Market Size (US$), By Type, 2018 – 2028
          7.3.3. Europe Power Module Packaging Market Size (US$), By Application, 2018 – 2028
          7.3.4. Europe Power Module Packaging Market Size (US$), By End-use, 2018 – 2028
     7.4. Asia Pacific Power Module Packaging Market Analysis , 2018 – 2028
          7.4.1.  Asia Pacific Power Module Packaging Market Size (US$), By Country, 2018 – 2028 
               7.4.1.1. China
               7.4.1.2. Japan
               7.4.1.3. India
               7.4.1.4. Rest of Asia Pacific
          7.4.2. Asia Pacific Power Module Packaging Market Size (US$), By Type, 2018 – 2028
          7.4.3. Asia Pacific Power Module Packaging Market Size (US$), By Application, 2018 – 2028
          7.4.4. Asia Pacific Power Module Packaging Market Size (US$), By End-use, 2018 – 2028
     7.5. Latin America Power Module Packaging Market Analysis, 2018 – 2028 
          7.5.1.  Latin America Power Module Packaging Market Size (US$), By Country, 2018 – 2028 
               7.5.1.1. Brazil
               7.5.1.2. Mexico
               7.5.1.3. Rest of Latin America
          7.5.2. Latin America Power Module Packaging Market Size (US$), By Type, 2018 – 2028
          7.5.3. Latin America Power Module Packaging Market Size (US$), By Application, 2018 – 2028
          7.5.4. Latin America Power Module Packaging Market Size (US$), By End-use, 2018 – 2028
     7.6. Middle East & Africa (MEA) Power Module Packaging Market Analysis, 2018 – 2028 
          7.6.1.  MEA Power Module Packaging Market Size (US$), By Region, 2018 – 2028 
               7.6.1.1. GCC Countries
               7.6.1.2. South Africa
               7.6.1.3. Rest of MEA
          7.6.2. MEA Power Module Packaging Market Size (US$), By Type, 2018 – 2028
          7.6.3. MEA Power Module Packaging Market Size (US$), By Application, 2018 – 2028
          7.6.4. MEA Power Module Packaging Market Size (US$), By End-use, 2018 – 2028

8. Company Profiles
     8.1. Competitive Analysis 
     8.2. Market Positioning of Key Vendors 
     8.3. Key Strategies adopted by the Leading Players
     8.4. Key Power Module Packaging Providers
        8.4.1 ACI Technologies, Inc.
                8.4.1.1 Business Description
                8.4.1.2 ACI Technologies, Inc. Geographic Operations
                8.4.1.3 ACI Technologies, Inc. Financial Information
                8.4.1.4 ACI Technologies, Inc. Product Positions/Portfolio
                8.4.1.5 ACI Technologies, Inc. Key Developments
        8.4.2 Danfoss
                8.4.2.1 Business Description
                8.4.2.2 Danfoss Geographic Operations
                8.4.2.3 Danfoss Financial Information
                8.4.2.4 Danfoss Product Positions/Portfolio
                8.4.2.5 Danfoss Key Developments
        8.4.3 Fuji Electric Co., Ltd.
                8.4.3.1 Business Description
                8.4.3.2 Fuji Electric Co., Ltd. Geographic Operations
                8.4.3.3 Fuji Electric Co., Ltd. Financial Information
                8.4.3.4 Fuji Electric Co., Ltd. Product Positions/Portfolio
                8.4.3.5 Fuji Electric Co., Ltd. Key Developments
        8.4.4 Infineon Technologies AG
                8.4.4.1 Business Description
                8.4.4.2 Infineon Technologies AG Geographic Operations
                8.4.4.3 Infineon Technologies AG Financial Information
                8.4.4.4 Infineon Technologies AG Product Positions/Portfolio
                8.4.4.5 Infineon Technologies AG Key Developments
        8.4.5 Maxim Integrated
                8.4.5.1 Business Description
                8.4.5.2 Maxim Integrated Geographic Operations
                8.4.5.3 Maxim Integrated Financial Information
                8.4.5.4 Maxim Integrated Product Positions/Portfolio
                8.4.5.5 Maxim Integrated Key Developments
        8.4.6 Microsemi
                8.4.6.1 Business Description
                8.4.6.2 Microsemi Geographic Operations
                8.4.6.3 Microsemi Financial Information
                8.4.6.4 Microsemi Product Positions/Portfolio
                8.4.6.5 Microsemi Key Developments
        8.4.7 Mitsubishi Electric Corporation
                8.4.7.1 Business Description
                8.4.7.2 Mitsubishi Electric Corporation Geographic Operations
                8.4.7.3 Mitsubishi Electric Corporation Financial Information
                8.4.7.4 Mitsubishi Electric Corporation Product Positions/Portfolio
                8.4.7.5 Mitsubishi Electric Corporation Key Developments
        8.4.8 SEMIKRON
                8.4.8.1 Business Description
                8.4.8.2 SEMIKRON Geographic Operations
                8.4.8.3 SEMIKRON Financial Information
                8.4.8.4 SEMIKRON Product Positions/Portfolio
                8.4.8.5 SEMIKRON Key Developments
        8.4.9 Texas Instruments Incorporated
                8.4.9.1 Business Description
                8.4.9.2 Texas Instruments Incorporated Geographic Operations
                8.4.9.3 Texas Instruments Incorporated Financial Information
                8.4.9.4 Texas Instruments Incorporated Product Positions/Portfolio
                8.4.9.5 Texas Instruments Incorporated Key Developments

LIST OF TABLES

TABLE 1 Market Snapshot: Global Power Module Packaging Market 
TABLE 2 Impact Indicators 
TABLE 3 Impact Analysis of Drivers and Restraints 
TABLE 4 North America Power Module Packaging Market Revenue, By Type, 2018 – 2028 (US$ Mn) 
TABLE 5 North America Power Module Packaging Market Revenue, By Application, 2018 – 2028 (US$ Mn) 
TABLE 6 North America Power Module Packaging Market Revenue, By End-use, 2018 – 2028 (US$ Mn) 
TABLE 7 Europe Power Module Packaging Market Revenue, By Type, 2018 – 2028 (US$ Mn) 
TABLE 8 Europe Power Module Packaging Market Revenue, By Application, 2018 – 2028 (US$ Mn) 
TABLE 9 Europe Power Module Packaging Market Revenue, By End-use, 2018 – 2028 (US$ Mn) 
TABLE 10 Asia Pacific Power Module Packaging Market Revenue, By Type, 2018 – 2028 (US$ Mn) 
TABLE 11 Asia Pacific Power Module Packaging Market Revenue, By Application, 2018 – 2028 (US$ Mn) 
TABLE 12 Asia Pacific Power Module Packaging Market Revenue, By End-use, 2018 – 2028 (US$ Mn) 
TABLE 13 Latin America Power Module Packaging Market Revenue, By Type, 2018 – 2028 (US$ Mn) 
TABLE 14 Latin America Power Module Packaging Market Revenue, By Application, 2018 – 2028 (US$ Mn) 
TABLE 15 Latin America Power Module Packaging Market Revenue, By End-use, 2018 – 2028 (US$ Mn)
TABLE 16 MEA Power Module Packaging Market Revenue, By Type, 2018 – 2028 (US$ Mn) 
TABLE 17 MEA Power Module Packaging Market Revenue, By Application, 2018 – 2028 (US$ Mn) 
TABLE 18 MEA Power Module Packaging Market Revenue, By End-use, 2018 – 2028 (US$ Mn)

LIST OF FIGURES

FIG. 1 Global Power Module Packaging: Market Segmentation 
FIG. 2 Global Power Module Packaging Market: Research Methodology 
FIG. 3 Top-Down and Bottom-up Approach 
FIG. 4 Global Power Module Packaging Market, By Type, 2019 (US$ Mn) 
FIG. 5 Global Power Module Packaging Market, By Application, 2019 (US$ Mn) 
FIG. 6 Global Power Module Packaging Market, By End-use, 2019 (US$ Mn) 
FIG. 7 Global Power Module Packaging Market, By Geography, 2019 (US$ Mn) 
FIG. 8 Global Power Module Packaging Market Revenue and Growth, 2018 – 2028, (US$ Mn) (Y-o-Y %)
FIG. 9 Attractive Investment Proposition 
FIG. 10 Market Positioning of Key Power Module Packaging Providers, 2019
FIG. 11 Global Power Module Packaging Market Revenue Contribution, By Type, 2019 & 2028 (Value %) 
FIG. 12 Global Power Module Packaging Market Revenue Contribution, By Application, 2019 & 2028 (Value %) 
FIG. 13 Global Power Module Packaging Market Revenue Contribution, By End-use, 2019 & 2028 (Value %) 
FIG. 14 North America Power Module Packaging Market Revenue, 2018 – 2028, (US$ Mn) 
FIG. 15 Europe Power Module Packaging Market Revenue, 2018 – 2028, (US$ Mn) 
FIG. 16 Asia Pacific Power Module Packaging Market Revenue, 2018 – 2028, (US$ Mn) 
FIG. 17 Latin America Power Module Packaging Market Revenue, 2018 – 2028, (US$ Mn)
FIG. 18 MEA Power Module Packaging Market Revenue, 2018 – 2028, (US$ Mn)

Key Takeaways:

1. Market value and estimate of the Power Module Packaging market for the period from 2020 to 2028
2. Compounded annual growth rate (CAGR%) for individual segments in various regional markets for a period from 2020 to 2028
3. Value chain analysis
4. Market share study combined with competitive landscape of major players
5. Profiles of major market players covering overall business operations, geographic occurrence, product portfolio, financial status and news coverage 

List of Tables

TABLE  Market Snapshot: Global Power Module Packaging Market
TABLE  Impact Pointers
TABLE  Impact Analysis of Drivers and Restraints
TABLE  North America Power Module Packaging Market Value, By Segment1, 2018 – 2028
TABLE  North America Power Module Packaging Market Value, By Segment2, 2018 – 2028
TABLE  North America Power Module Packaging Market Value, By Country, 2018 – 2028
TABLE  Europe Power Module Packaging Market Value, By Segment1, 2018 – 2028
TABLE  Europe Power Module Packaging Market Value, By Segment2, 2018 – 2028
TABLE  Europe Power Module Packaging Market Value, By Country, 2018 – 2028
TABLE  Asia Pacific Power Module Packaging Market Value, By Segment1, 2018 – 2028
TABLE  Asia Pacific Power Module Packaging Market Value, By Segment2, 2018 – 2028
TABLE  Asia Pacific Power Module Packaging Market Value, By Country, 2018 – 2028
TABLE  Latin America Power Module Packaging Market Value, By Segment1, 2018 – 2028
TABLE  Latin America Power Module Packaging Market Value, By Segment2, 2018 – 2028
TABLE  Latin America Power Module Packaging Market Value, By Country, 2018 – 2028
TABLE  MEA Power Module Packaging Market Value, By Segment1, 2018 – 2028
TABLE  MEA Power Module Packaging Market Value, By Segment2, 2018 – 2028
TABLE  MEA Power Module Packaging Market Value, By Country, 2018 – 2028
TABLE  ACI Technologies, Inc.: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Danfoss: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Fuji Electric Co., Ltd.: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Infineon Technologies AG: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Maxim Integrated: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Microsemi: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Mitsubishi Electric Corporation: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  SEMIKRON: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
TABLE  Texas Instruments Incorporated: Company Snapshot (Company Details, Geographical Presence, Product Portfolio, Recent News and Announcements)
 

List of Figures

FIG.  Global Power Module Packaging Market: Research Methodology
FIG.  Top-Down and Bottom Up Approach
FIG.  Global Power Module Packaging Market, By Segment1, 2019 (US$ Mn)
FIG.  Global Power Module Packaging Market, By Segment2, 2019 (US$ Mn)
FIG.  Global Power Module Packaging Market, By Geography, 2019 (US$ Mn)
FIG.  Global Power Module Packaging Market Value and Growth, 2018 – 2028, (US$ Mn) (Y-o-Y %)
FIG.  Attractive Investment Proposition
FIG.  Market Positioning of Key Power Module Packaging Providers, 2016
FIG.  Global Power Module Packaging Market Value Share, By Segment1, 2019 & 2028 (% Value)
FIG.  Global SiC Module Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global FET Module Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global IGBT Module Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Thyristors Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Power Module Packaging Market Value Share, By Segment2, 2019 & 2028 (% Value)
FIG.  Global EV/Hybrid Electric Vehicles Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global HEV Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Motors Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Rail Tractions Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Wind Turbines Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Photovoltaic Equipment Market Value, 2018 – 2028, (US$ Mn)
FIG.  Global Market Value, 2018 – 2028, (US$ Mn)
FIG.  U.S. Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  Canada Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  UK Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  Germany Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  France Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  Rest of Europe Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  China Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  Japan Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  India Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  Rest of Asia Pacific Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  Mexico Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  Brazil Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  Rest of Latin America Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  GCC Countries Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  South Africa Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)
FIG.  Rest of MEA Power Module Packaging Market Value, 2018 – 2028, (US$ Mn)